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Controlled Wetting and Spreading of Silver on Ceramics Using Porous Nickel Interlayers

Executive SummaryCeramic substrates such as alumina, aluminum nitride, or beryllium oxide are highly thermally conductive and can dissipate heat quickly across a surface, preventing heat build-up and improving the life of the semiconductors junctions on a printed circuit board (PCB). Therefore, ceramic substrates are ideal for high amperage and high...
Published: 2/17/2023   |   Inventor(s): Quan Zhou, Jason Nicholas, Thomas Bieler
Keywords(s):   Category(s): Electrical, Advanced Materials, Computer Hardware, Materials

Advanced Ceramic-to-Metal Brazing

Executive Summary Joining dissimilar materials has been an area of study for many decades, with many challenges still being addressed. Our invention allows for a superior brazed joint between ceramic and metal components, with an end product that has less defects – and therefore a stronger bond – than typical brazing methods allow. Description...
Published: 2/17/2023   |   Inventor(s): Jason Nicholas, Quan Zhou, Thomas Bieler, Rick Kerr
Keywords(s):   Category(s): Advanced Materials, Energy