Scanning interferometry technique for through-thickness defect/damage evaluation in multi-layered transparent structures

 

Introduction

 

High-strength, impact-resistant windshields, security components, and other multi-layered transparent composites (TC) are often constructed with glass and polymer laminates.  Precise measurement of flaws in these structures, in all three dimensions, has not been possible.  As a result, manufacturing costs include unnecessary scrap, and components in operation may be replaced prematurely.

 

Description of Technology

 

Due to the thicknesses of some transparent composites, measurement techniques provide two-dimensional reading in the XY. This innovation adds measurements in the Z dimension, detecting defects within transparent multi-layered structures at various depth locations using high spatial resolution. It is capable of non-invasive, non-contact, and real-time defect depth location and size measurement in in three dimensions. This measurement tool can help address costly damage, defects, delamination, regions of transparency loss, and mechanical stress.  

 

Key Benefits

  • Versatility: Measurement technique may be used in production and for field evaluations.     
  • Three Dimensions: Quality measure can be done in transparent structures in all three dimensions.
  • Costs Reductions: The technique promises to reduce both manufacturing costs and expenses related to the premature replacement of transparent parts in operation.

 

Applications

  • Armored Vehicles
  • Aerospace
  • Transparent Security Windows
  • High-Strength Industrial Windows

 

Patent Status

 

Patent Pending

 

Inventors

 

Anton Khomenko, Mahmoodhul Haq, Gary Cloud

 

Tech ID

 

TEC2013-0089

 

Patent Information:

Category(s):

For Information, Contact:

Bradley Shaw
Technology Manager
Michigan State University
shawbr@msu.edu
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