Scanning interferometry technique for through-thickness defect/damage evaluation in multi-layered transparent structures




High-strength, impact-resistant windshields, security components, and other multi-layered transparent composites (TC) are often constructed with glass and polymer laminates.  Precise measurement of flaws in these structures, in all three dimensions, has not been possible.  As a result, manufacturing costs include unnecessary scrap, and components in operation may be replaced prematurely.


Description of Technology


Due to the thicknesses of some transparent composites, measurement techniques provide two-dimensional reading in the XY. This innovation adds measurements in the Z dimension, detecting defects within transparent multi-layered structures at various depth locations using high spatial resolution. It is capable of non-invasive, non-contact, and real-time defect depth location and size measurement in in three dimensions. This measurement tool can help address costly damage, defects, delamination, regions of transparency loss, and mechanical stress.  


Key Benefits

  • Versatility: Measurement technique may be used in production and for field evaluations.     
  • Three Dimensions: Quality measure can be done in transparent structures in all three dimensions.
  • Costs Reductions: The technique promises to reduce both manufacturing costs and expenses related to the premature replacement of transparent parts in operation.



  • Armored Vehicles
  • Aerospace
  • Transparent Security Windows
  • High-Strength Industrial Windows


Patent Status


Patent Pending




Anton Khomenko, Mahmoodhul Haq, Gary Cloud


Tech ID




Patent Information:


For Information, Contact:

Brian Copple
Technology Manager
Michigan State University