2D SHAPE SENSING AND RECONSTRUCTION SYSTEM
Case ID:
TEC2025-0152
Web Published:
8/19/2025
VAlue proposition
Accurate shape sensing is crucial in robotics, biomedical engineering, and structural health monitoring for tasks like robotic guidance and infrastructure assessment. However, challenges such as dealing with complex geometries during sensing and data acquisition while maintaining high accuracy remain. This technology is a flexible differential inductive sensor array for 2D shape sensing and reconstruction.
Description of Technology
The system employs two FPCB-based inductive sensor strips, separated by a fixed distance, to measure curvature through relative inductance shifts. The differential design suppresses background noise and improves signal to noise ratio. Initial results showed that smaller spacing extends the dynamic range of measurable curvature, while larger spacing enhances resolutions for larger curvature measurement. The prototype system incorporated a 3D-printed flexible framework, a miniaturized circuit system, and shape reconstruction algorithms. The validation results using 3D-printed arc strips demonstrated a maximum error up to 3.26% for a curvature radius of 40 mm and an average error of 1.72% across the range of 40–400 mm. The system's capability was further demonstrated on a dented/defective pipe using 3D geometry reconstruction. These results highlight the system's high accuracy, superior resolution, and great adaptability for various potential applications, offering advances for optimizing shape sensing.
Benefits
- flexible sensor array
- nondestructive evaluation
Applications
- Inductive sensing
- shape reconstruction and sensing
- curvature measurement
- structure health monitoring
- composite structures
IP Status
Patent Pending
LICENSING RIGHTS AVAILABLE
Full licensing rights available
Developer: Yiming Deng and Lei Peng
Tech ID: TEC2025-0152
For more information about this technology,
contact Raymond DeVito Ph. D. at devitora@msu.edu or 1(517)884-1658
Patent Information:
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For Information, Contact:
Raymond Devito
Technology Manager
Michigan State University
devitora@msu.edu