MSU Technologies

High Frequency Interconnect to Semiconductor Device

VALUE PROPOSITION

High frequency electronic devices are an important technology for a variety of applications ranging from biomedical imaging, photon lasers, and high-volume data transmission. As these devices become more complex, multiple integrated circuits (ICs) need to be connected. Interconnect systems have been developed to allow for interaction between the semiconductor devices. There are three major issues present for interconnect manufacturing: high-frequency ability, wide bandgap utility, and packaging. There are two current methods that address these issues; however, each contains a tradeoff in performance.

DESCRIPTION OF TECHNOLOGY

Our technology generates an ultra-wide band, low loss interconnect system that does not require wire matching and does not pose the mechanical limitations of flip chip systems. The technology utilizes aerosol jet printed polyimide to provide packaging around the device. Silver nanowire is printed on top of the polyimide to provide the conductive interconnects allowing for more system versatility and overall smaller packaging.

BENEFITS