MSU Technologies

Scanning interferometry technique for through-thickness defect/damage evaluation in multi-layered transparent structures

Introduction

High-strength, impact-resistant windshields, security components, and other multi-layered transparent composites (TC) are often constructed with glass and polymer laminates. Precise measurement of flaws in these structures, in all three dimensions, has not been possible. As a result, manufacturing costs include unnecessary scrap, and components in operation may be replaced prematurely.

Description of Technology

Due to the thicknesses of some transparent composites, measurement techniques provide two-dimensional reading in the XY. This innovation adds measurements in the Z dimension, detecting defects within transparent multi-layered structures at various depth locations using high spatial resolution. It is capable of non-invasive, non-contact, and real-time defect depth location and size measurement in in three dimensions. This measurement tool can help address costly damage, defects, delamination, regions of transparency loss, and mechanical stress.

Key Benefits

Versatility: Measurement technique may be used in production and for field evaluations.
Three Dimensions: Quality measure can be done in transparent structures in all three dimensions.
Costs Reductions: The technique promises to reduce both manufacturing costs and expenses related to the premature replacement of transparent parts in operation.

Applications