Scanning interferometry technique for through-thickness defect/damage evaluation in multi-layered transparent structures
High-strength, impact-resistant windshields, security components, and other multi-layered transparent composites (TC) are often constructed with glass and polymer laminates. Precise measurement of flaws in these structures, in all three dimensions, has not been possible. As a result, manufacturing costs include unnecessary scrap, and components in operation may be replaced prematurely.
Description of Technology
Due to the thicknesses of some transparent composites, measurement techniques provide two-dimensional reading in the XY. This innovation adds measurements in the Z dimension, detecting defects within transparent multi-layered structures at various depth locations using high spatial resolution. It is capable of non-invasive, non-contact, and real-time defect depth location and size measurement in in three dimensions. This measurement tool can help address costly damage, defects, delamination, regions of transparency loss, and mechanical stress.
- Versatility: Measurement technique may be used in production and for field evaluations.
- Three Dimensions: Quality measure can be done in transparent structures in all three dimensions.
- Costs Reductions: The technique promises to reduce both manufacturing costs and expenses related to the premature replacement of transparent parts in operation.
- Armored Vehicles
- Transparent Security Windows
- High-Strength Industrial Windows
Anton Khomenko, Mahmoodhul Haq, Gary Cloud
For Information, Contact:
Michigan State University