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Composite Metal Matrix Castings and Solder Compositions and Methods for Microelectronics and Metal Matrix Castings

IntroductionThe rapid advance in the miniaturization of electronic components require novel soldering solutions with sub-micron reinforcements. Sub-micron reinforcements can minimize grain boundary sliding. Another challenge is increased current density in Micro-Electro-Mechanical Systems (MEMS). Ion migration across electrodes causes voids and ultimately...