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Photopolymerizable Compositions for Encapsulating Microelectronic Devices in High-Speed Manufacturing

IntroductionComposite materials are typically comprised of two-phase materials. There is a continuous binder (matrix) phase and a stronger or stiffer (discontinuous) reinforcement material phase. To achieve high speeds in manufacturing, reaction injection molding (RIM) techniques have been employed widely.However, resins (e.g., unsaturated polyesters,...