Concentric Helical Coils for Efficient and Resilient Wireless Link for Biomedical Implants

 

Executive Summary

 

Originally developed for neural implants in monkeys, this invention allows for in vivo wireless data and power transmission as minimally invasive as possible. By removing wires penetrating through the skin, the possibility of infection and inflammation are greatly reduced and is all-around more comfortable for the subject. Additionally by increasing the area responsible for power and data transmission and improving coil alignment, the product is safer and more efficient than current technology.

 

 

Description of Technology

 

Current implants utilizing wireless data and power transmission include artificial hearts, pacemakers, and chronic illness monitors. Many implants requiring large amounts of power utilize coil pads on either side of the skin to transmit power, but are high risk to misalignment and high power densities – both of which may irritate or even burn the skin of the subject. Instead, MSU researcher have improved coil alignment and reduced power densities by looping a coil around a subject’s extremity and using a collar or band as the external component to provide power and receive data via inductive coupling and OOK (on off keying) using radio frequencies. By doing so coils are far less likely to be misaligned, resulting in a safer and more efficient product.

 

Key Benefits

  • Safer – Lower power density allows for transmission of power without damaging tissue
  • Efficient – Improved coil alignment increases the efficiency and safety of power transmission
  • Less Invasive – Current technologies may require wires to exit/enter the body
  • Rapid Charging – Lower power density allows for more power to be transmitted at once

 

Applications

  • Neural monitoring
  • Bionic implants
  • Monitoring implants

 

Patent Status:

 

Patent pending

 

Licensing Rights Available

 

Full licensing rights available

 

Inventors: Dr. Andrew Mason

 

Tech ID: TEC2017-0082

 

Patent Information:

For Information, Contact:

Raymond DeVito
Technology Manager
Michigan State University
devitora@msu.edu
Keywords: